College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding

Applied Materials · SGP, Singapore · More jobs in Singapore · Singapore

Data & AI · on-site · Internship

Published by the employer 2026-09-04 · Last observed 2026-10-15

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Interns · SGP, Singapore Full requirements and the application form are on the employer's original listing.

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