Packaging Module Development Engineer

Intel · US, Oregon, Hillsboro · More jobs in Hillsboro · United States

Manufacturing & production

View role at the original source ↗

About the role

US, Oregon, Hillsboro Full requirements and the application form are on the employer's original listing.

More at Intel

• Substrate Capacity Manager · Intel · Kulim, Malaysia
• Module Equipment Technician · Intel · Malaysia, Penang
• Module Equipment Technician (Contract) · Intel · Malaysia, Penang
• Module Engineer · Intel · Malaysia, Penang
• Logistics Operations Manager for Customs compliance operations · Intel · Vietnam, Ho_Chi_Minh_City
• Chassis IP Design Engineer · Intel · India, Bangalore

Report an issue or request correction